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SemiConductor Wafer Bonding: Science and Technology (The ECS Series of Texts and Monographs) book cover by Q.-Y. Tong, U. Gösele
Hardcover

SemiConductor Wafer Bonding: Science and Technology (The ECS Series of Texts and Monographs)

by Q.-Y. Tong and U. Gösele

$175.06 / copy at 25+ copies As low as $164.76 at 1,000+Your best volume price

Total $4,376.50

Hardcover · 320 pages Wiley · 1998

Format

Hardcover
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About the book

SemiConductor Wafer Bonding

A one-stop resource on all aspects of semiconductor wafer bonding for materials scientists and electrical engineers

Semiconductor Wafer Bonding addresses the entire spectrum of mainstream and likely future applications of wafer bonding. It examines all of the important issues surrounding this technology, including basic interactions between flat surfaces, the influence of particles, surface steps and cavities, surface preparation and room-temperature wafer bonding, thermal treatment of bonded wafer pairs, and much more.

This unique, one-stop resource consolidates information previously available only by time-consuming searches through technical journals, proceedings, and book chapters for more than 1,000 published articles on wafer bonding. It covers all materials used for wafer bonding-including silicon, III-V compounds, fused and crystalline quartz, glass, silicon carbide, sapphire, ferroelectrics, and many others.

For materials scientists and electrical engineers who need to exploit the potential of this flourishing technology, Semiconductor Wafer Bonding is a convenient one-stop resource for answers to many common questions. It is also an excellent text/reference for graduate students eager to learn about this interdisciplinary field, which spans surface chemistry, solid-state physics, materials science, and electrical engineering.

The book, SemiConductor Wafer Bonding: Science and Technology (The ECS Series of Texts and Monographs) [Bulk, Wholesale, Quantity] ISBN#9780471574811 in Hardcover by Q.-Y. Tong, U. Gösele may be ordered in bulk quantities. Minimum starts at 25 copies. Availability based on publisher status and quantity being ordered.

Details

Publisher
Wiley
Authors
Q.-Y. Tong, U. Gösele
Format
Hardcover
Published
Dec 7, 1998
ISBN-13
9780471574811
Pages
320
Carton quantity
24 copies
Printing
Printed on demand
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CopiesPrice per copyYou save
25 – 99 $175.06 15% off list
100 – 249 $173.00 16% off list
250 – 499 $170.94 17% off list
500 – 999 $168.88 18% off list
1,000+ $164.76 20% off list
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What does SemiConductor Wafer Bonding cost when I buy for a group?

Volume pricing applies automatically in your cart, with no code needed. Price per copy: 25 to 99 copies, $175.06 (15% off list); 100 to 249 copies, $173.00 (16% off list); 250 to 499 copies, $170.94 (17% off list); 500 to 999 copies, $168.88 (18% off list); 1,000+ copies, $164.76 (20% off list). Need a different quantity, or a quote to forward for approval? Ask a specialist and we will confirm pricing before you pay.

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